Seung-Han Lee, a doctoral candidate from the Department of Electrical Engineering at KAIST, received the Best Paper Award at the International Symposium on Quality Electronic Design (ISQED). Titled “Security in a Connected World,” this year’s ISQED was held from March 3 to 5 at the Santa Clara Convention Center in California, United States.
▲ Seung-Han Lee won the Best Paper Award for this year's ISQED
The International Symposium on Quality Electronic Design (ISQED) is one of the world’s leading integrative conference on electronic design, with the purpose of promoting electronic and semiconductor fields. The conference provides various resources including the state of the art electronic design tools, integrated circuit technologies, semiconductor technology, and packaging technology in order to strengthen the quality of design.
Some of the main topics discussed in the conference include design for manufacturability and design for quality, which are the key issues in semiconductor design and processing. The annual conference provides participants with opportunities to exchange their ideas and experiences regarding design technologies to solve the problems related to integrated circuit design. ISQED encourages a comprehensive approach in design and emphasizes active cooperation and communication among the communities in electronic and semiconductor fields.

Three-dimensional processor-memory system allows multiple cache dies to be stacked onto multi-core die vertically. This reduces latency and power of the wires connecting the cores and the cache, thereby increasing the power efficiency. However, there are problems associated with processor-cache memory traffic and high power density, which cause many temperature-related problems. In his research paper, Lee proposed the method of using three-dimensional stacks in order to minimize the overall energy of three-dimensional chip multiprocessors (CMPs). The proposed method solved the problems regarding temperature distribution and memory traffic of CMPs by achieving up to 22.88% energy reduction from the existing method, which only focused on the temperature distribution. 

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