The research team led by Professor Kyung Wook Paik from the Department of Materials Science and Engineering developed a new low-cost flexible packaging technology by using anisotropic conductive film (ACF). This new material allows both better electrical conductivity and enhanced flexibility. Electronic packaging technology is used for producing the hardware structure of all electronic products, ranging from smartphones to household electric appliances.This technology decides the size, performance, and price of an electronic product. It will take on a significant role in the realization of future wearable electronic products.

The new low-cost flexible packaging technology grinds the existing thick semiconductor device and reduces it to a thickness of 30 to 50 micrometers. Then the device is packaged in flexible printed circuit boards (FPCBs) by using ACF, which is composed of conductive particles and thermosetting polymer film. According to professor Paik’s research team, the newly developed packaging technology has several advantages over the existing flexible semiconductor technology. It requires a simpler process as well as lower cost. Also, the semiconductor developed by the new technology has more desirable mechanical properties - high electrical performance and flexibility even when it is bent till its diameter becomes 6 millimeters. Furthermore, the new packaging technology is environmentally friendly, since it does not use any materials or processes that can potentially cause pollution.

This novel flexible packaging technology is expected to be widely applied in the field of electronic products assembly, including the central processing unit, memory semiconductor of wearable computers, various semiconductor sensors, flexible smartphones, and flexible displays. Professor Paik said that wearable devices would allow people to control computers and receive calls and messages with just simple hand gestures. He added, “The development of this new packaging technology will bring us one step closer to this new generation of wearable computers.”